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POP Technology
- Categories:技术服务
- Time of issue:2018-06-15 00:00:00
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Description:
Information
| POP process
The emergence of POP(Package on Package) stack assembly technology greatly improves the logic operation function and storage space, and provides the end users with the possibility of free selection of device combinations, and the production cost can be more effectively controlled. Minimum installation density: 0.3mm, BGA spacing up to 0.4 PITCH |
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