Member enterprises
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He (Xiamen) Semiconductor Technology Co., Ltd.

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Focus areas: optical communication high-frequency packaging, MEMS packaging, GaN/SiC packaging, military packaging, TSV 3D packaging technology

In mainland China, the company is competing in the global advanced semiconductor packaging frontier market. The biggest bright spot that can maintain its confidence in the current complex international and domestic environment and fierce competition in the global industry lies in the advanced VR Scan MEMS packaging process. GaN/SiC/5G RF packaging technology expertise; Military packaging technology expertise; TSV 3D Packaging Technology: Through Silicon Via Technology (Through Silicon, TSV) is a high-density packaging technology, which is gradually replacing the current mature wire bonding technology and is considered to be the fourth generation packaging technology. The company's main focus: surface mount technology-SMT, chip & wire/cob (chip surface mount), value-mounted chip mount. Widely used in communications products-high frequency 50GHz applications, industrial and transportation sensor applications, industrial applications, military and other high-tech fields.